Formulation Material Selection

Electrically and Thermally Conductive Adhesives Formulation Strategies

Language: English
Length: 90 min
Recorded on: 01 Jul 25

Package Includes

6 months access to Course Recording, Presentation Slides, Q&A Transcript

Course Description

Increase electrical & thermal conductivity of your adhesives without compromising on adhesion, durability, combined resistance to high humidity & elevated temperature. Renew your adhesive formulation strategy to meet today’s performance demands for advanced electronics, miniaturized components, and harsh operating conditions.


In this simulated live Edward Petrie will guide you to:

  • Formulate adhesives for high conductivity with the right material selection and processing techniques.
  • Maintain performance under real-world stressors like heat, moisture, and mechanical strain.
  • Reduce shrinkage and stress in sensitive or flexible electronic assemblies and miniaturized parts.
  • Apply proven strategies from real-world case studies across electronics, automotive, and medical applications.
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Edward M Petrie
Edward M Petrie
EMP Solutions
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Edward Petrie has been active in the adhesives industry for over 35 years, both in the formulation and end-use sides. He has a BS (Chemical Engineering) and MS (Polymer Science) degrees from Carnegie Mellon University and an MBA from Duquesne University.

Throughout his industrial career, Mr. Petrie has been employed by two major global corporations ABB and Westinghouse as an internal consultant in adhesives and polymeric materials. In both corporations, he was part of the Central Research Laboratories and assisted all of the divisions within the organization.

His expertise includes material and process selection, testing, formulating, substrate preparation, and quality control, with emphasis on the end-user application and performance requirements. Applications include structural and non-structural joining of all materials. Mr. Petrie is also an expert in joining polymeric materials by all methods, including mechanical fastening, self-fastening, and heat and solvent welding.

Mr. Petrie has authored over 100 papers on adhesives as well as the popular Handbook of Adhesives and Sealants (McGraw-Hill, October 2000) and Plastic Materials and Processes – A Concise Encyclopedia (John Wiley & Sons, August 2003). He has also given seminars and adhesives and adhesion to corporations, universities, and government organizations.

Mr. Petrie is an independent consultant and sole proprietor of EMP Solutions. He is also a Technical Advisor and Consultant to adhesives.specialchem.com, an online service platform dedicated entirely to adhesives and sealants.

Participants of this course includes

Why should you view this course?

Technological advancements in the electrical and electronic industry have led to a surge in the demand for advanced adhesives that offer high bond strength, combined with resistance to high humidity and temperature.

However, achieving both thermal conductivity and electrical insulation in an adhesive at the same time is tricky. It requires the addition of filler materials (such as silver, gold, boron nitride, or silica) to develop a suitable conductive adhesive.

  1. Better design your formulation strategy by understanding the key requirements of electrically and/or thermally conductive adhesives.

  2. Make the right selection of ingredients by reviewing the applicable materials and processing properties.

  3. Maximize the performance of your conductive adhesives (combine high conductivity with better adhesion, durability, resistance to high humidity and temperature...) by adopting the best formulation practices.

Who should join this course?
  • Formulators and end-users who need to develop and select electrically and/or thermally conductive adhesives.

  • This course is suitable for intermediate level proficiency
    Intermediate
Questions you will be able to answer after this course:
  1. How do I choose the right filler type and loading for the conductivity I need?

  2. How do I ensure good adhesion to dissimilar substrates like metals and plastics?

  3. Which resin systems (epoxy, silicone, polyurethane, etc.) are best for my application?

  4. How do I keep costs in check when using high-end fillers like silver?

Course Outline
The following sections will be covered during this session:

Introduction: Why Electrical and / or Thermal Conductivity?

  • Need for Electrical and / or Thermal Conductivity

Mechanism of Conduction

  • Conduction mechanism
  • Filler properties
  • Additives

Important and Unique Requirements / User Selection

  • Major applications
  • Special Requirements in E/E Applications​
  • Test methods

Combining High Conductivity with Better Adhesion, Durability, High Humidity & Temperature Resistance:

  • Formulation Principles
  • How Application and Service Environments Affect Properties
  • Polymeric Resin Requirements​
  • Common Electrically Conductive Particles​
  • Nanoparticles

Specialty Adhesives and Applications

  • Real-life examples: flexible device assembly, reduced stress and shrinkage, miniaturized parts…

Trends in Development

  • High-performance conductive fillers​
  • Lower cost conductive fillers​
  • Conductive hybrids
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Prerequisites for this course

It would be beneficial to have some prior knowledge of:

  • Principles of adhesive formulation, including the roles of various components such as resins, hardeners, and fillers.
  • Processing properties relevant to adhesive application, including curing methods and substrate preparation.
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