Formulation Strategies for Multi-Substrate Bonding
Package Includes
6 months access to Course Recording, Presentation Slides, Q&A Transcript
Course Description
Design promising bonding solutions for dissimilar substrates in creative new structures or parts with tailored properties (e.g., lightweight vehicles, new-age electronics...).
Edward Petrie will share material selection tips, formulation strategies, joint designs, and processing requirements to control thermal expansion coefficients, reduce internal shrinkage, extend service temperature ranges, and more—helping you design flexible yet tough structural adhesives for multi-substrate bonding.
Edward M Petrie
EMP SolutionsWhy should you view this course?
Who should join this course?
-
This course is suitable for intermediate level proficiency
Intermediate
Course Outline