Formulation Material Selection

Formulation Strategies for Multi-Substrate Bonding

Formulation Strategies for Multi-Substrate Bonding
Language: English
Length: 90 min
Recorded on: 03 Apr 19

Package Includes

6 months access to Course Recording, Presentation Slides, Q&A Transcript

Course Description

Design promising bonding solutions for dissimilar substrates in creative new structures or parts with tailored properties (e.g., lightweight vehicles, new-age electronics...).



Edward Petrie will share material selection tips, formulation strategies, joint designs, and processing requirements to control thermal expansion coefficients, reduce internal shrinkage, extend service temperature ranges, and more—helping you design flexible yet tough structural adhesives for multi-substrate bonding.

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Edward M Petrie
Edward M Petrie
EMP Solutions
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Edward Petrie has been active in the adhesives industry for over 35 years, both in the formulation and end-use sides. He has a BS (Chemical Engineering) and MS (Polymer Science) degrees from Carnegie Mellon University and an MBA from Duquesne University.

Throughout his industrial career, Mr. Petrie has been employed by two major global corporations ABB and Westinghouse as an internal consultant in adhesives and polymeric materials. In both corporations, he was part of the Central Research Laboratories and assisted all of the divisions within the organization.

His expertise includes material and process selection, testing, formulating, substrate preparation, and quality control, with emphasis on the end-user application and performance requirements. Applications include structural and non-structural joining of all materials. Mr. Petrie is also an expert in joining polymeric materials by all methods, including mechanical fastening, self-fastening, and heat and solvent welding.

Mr. Petrie has authored over 100 papers on adhesives as well as the popular Handbook of Adhesives and Sealants (McGraw-Hill, October 2000) and Plastic Materials and Processes – A Concise Encyclopedia (John Wiley & Sons, August 2003). He has also given seminars and adhesives and adhesion to corporations, universities, and government organizations.

Mr. Petrie is an independent consultant and sole proprietor of EMP Solutions. He is also a Technical Advisor and Consultant to adhesives.specialchem.com, an online service platform dedicated entirely to adhesives and sealants.

Why should you view this course?

Consumer and industrial products (e.g., automotive, medical, electronics, etc.) are witnessing advances in technology to decrease weight, improve performance, and reduce cost. As a result, the adhesive industry faces challenges in optimally bonding multi-substrates and reducing internal stress levels. However, a lack of knowledge regarding materials, properties, formulations, processing, and joint designs can lead to early product failure and eventual customer dissatisfaction. Time is precious, so make smarter choices! Join the live course to:

  1. Gain knowledge of the unique requirements of dissimilar joints

  2. Understand the types of adhesives & formulations (epoxies, vinyl copolymers, acrylic, urethane) for flexible yet tough multi-substrate bonds

  3. Enhance your know-how on processing techniques & joint designs that are most successful

  4. Improve your understanding of emerging technologies in the industries (automotive, medical, electronics, etc.)

  5. Avoid early product failure & meet today’s consumer/industrial requirements (decrease weight, improve performance, and reduce cost)

Who should join this course?
    • Adhesive formulators and R&D professionals
    • Design engineers
    • End-users engaged in:
      Bonding dissimilar materials
      Failure analysis

  • This course is suitable for intermediate level proficiency
    Intermediate
Course Outline

Why Bonding Dissimilar Materials is Difficult – The Problem of Internal Stress and Cure Shrinkage

Solutions Available for the Formulator and End-User

Optimal Adhesives Formulations for Reducing Internal Stress

  • Polymer technologies (elastomers, epoxies, vinyl copolymers, acrylic, urethane...)
  • Optimization of properties (controlling thermal expansion coefficient, extending the service temperature range...)

Optimal Joint Designs

Optimal Cure Conditions (including time-temperature staged cure)

New End-Use Applications

  • Lightweight automotive structures
  • New-age medical & electronic products
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Formulation Strategies for Multi-Substrate Bonding
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